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INTEGRATED CIRCUITS
DATA SHEET
PCF8574 Remote 8-bit I/O expander for I2C-bus
Product specification Supersedes data of September 1994 File under Integrated Circuits, IC12 1997 Apr 02
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
CONTENTS 1 2 3 4 5 6 6.1 6.2 6.3 6.4 7 7.1 7.2 7.3 8 9 10 11 12 13 13.1 13.2 13.2.1 13.2.2 13.3 13.3.1 13.3.2 13.3.3 14 15 16 FEATURES GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING CHARACTERISTICS OF THE I2C-BUS Bit transfer Start and stop conditions System configuration Acknowledge FUNCTIONAL DESCRIPTION Addressing Interrupt Quasi-bidirectional I/Os LIMITING VALUES HANDLING DC CHARACTERISTICS I2C-BUS TIMING CHARACTERISTICS PACKAGE OUTLINES SOLDERING Introduction DIP Soldering by dipping or by wave Repairing soldered joints SO and SSOP Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS
PCF8574
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
1 FEATURES 2 GENERAL DESCRIPTION
PCF8574
* Operating supply voltage 2.5 to 6 V * Low standby current consumption of 10 A maximum * I2C to parallel port expander * Open-drain interrupt output * 8-bit remote I/O port for the I2C-bus * Compatible with most microcontrollers * Latched outputs with high current drive capability for directly driving LEDs * Address by 3 hardware address pins for use of up to 8 devices (up to 16 with PCF8574A) * DIP16, or space-saving SO16 or SSOP20 packages.
The PCF8574 is a silicon CMOS circuit. It provides general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional bus (I2C). The device consists of an 8-bit quasi-bidirectional port and an I2C-bus interface. The PCF8574 has a low current consumption and includes latched outputs with high current drive capability for directly driving LEDs. It also possesses an interrupt line (INT) which can be connected to the interrupt logic of the microcontroller. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via the I2C-bus. This means that the PCF8574 can remain a simple slave device. The PCF8574 and PCF8574A versions differ only in their slave address as shown in Fig.9.
3
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION plastic dual in-line package; 16 leads (300 mil) plastic small outline package; 16 leads; body width 7.5 mm plastic shrink small outline package; 20 leads; body width 4.4 mm VERSION SOT38-1 SOT162-1 SOT266-1
PCF8574P; PCF8574AP PCF8574T; PCF8574AT PCF8574TS
DIP16 SO16 SSOP20
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
4 BLOCK DIAGRAM
PCF8574
handbook, full pagewidth
INT A0 A1 A2 SCL SDA
13 1 2 3 14 15 INPUT FILTER
INTERRUPT LOGIC
LP FILTER
PCF8574
4 5 6 I 2 C BUS CONTROL 7 SHIFT REGISTER 8 BIT I/O PORT 9 10 11 12 P0 P1 P2 P3 P4 P5 P6 P7
WRITE pulse VDD V SS 16 8 POWER-ON RESET READ pulse
MBD980
Fig.1 Block diagram (SOT38-1 and SOT162-1).
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
5 PINNING PIN SYMBOL DIP16; SO16 A0 A1 A2 P0 P1 P2 P3 VSS P4 P5 P6 P7 INT SCL SDA VDD n.c. n.c. n.c. n.c. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 - - - - SSOP20 6 7 9 10 11 12 14 15 16 17 19 20 1 2 4 5 3 8 13 18 address input 0 address input 1 address input 2 quasi-bidirectional I/O 0 quasi-bidirectional I/O 1 quasi-bidirectional I/O 2 quasi-bidirectional I/O 3 supply ground quasi-bidirectional I/O 4 quasi-bidirectional I/O 5 quasi-bidirectional I/O 6 quasi-bidirectional I/O 7 interrupt output (active LOW) serial clock line serial data line supply voltage not connected not connected not connected not connected DESCRIPTION
PCF8574
handbook, halfpage
INT
handbook, halfpage
1 2 3 4 5 PCF8574TS 6 7 8 9
20 19 18 17 16 15 14 13 12 11
MBD978
P7 P6 n.c. P5 P4 VSS P3 n.c. P2 P1
A0 A1 A2 P0 P1 P2 P3 VSS
1 2 3 4 5 6 7 8
MBD979
16 VDD 15 14 PCF8574 PCF8574A 13 12 SDA SCL INT P7
SCL n.c. SDA VDD A0 A1 n.c. A2
11 P6 10 9 P5 P4
P0 10
Fig.2 Pin configuration (DIP16; SO16).
Fig.3 Pin configuration (SSOP20).
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
6 CHARACTERISTICS OF THE I2C-BUS 6.2 Start and stop conditions
PCF8574
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 6.1 Bit transfer
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the stop condition (P) (see Fig.5). 6.3 System configuration
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Fig.4).
A device generating a message is a `transmitter', a device receiving is the `receiver'. The device that controls the message is the `master' and the devices which are controlled by the master are the `slaves' (see Fig.6).
SDA
SCL data line stable; data valid change of data allowed
MBC621
Fig.4 Bit transfer.
SDA
SDA
SCL S START condition P STOP condition
SCL
MBC622
Fig.5 Definition of start and stop conditions.
SDA SCL MASTER TRANSMITTER / RECEIVER SLAVE TRANSMITTER / RECEIVER MASTER TRANSMITTER / RECEIVER
MBA605
SLAVE RECEIVER
MASTER TRANSMITTER
Fig.6 System configuration.
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
6.4 Acknowledge
PCF8574
transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse, set-up and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a stop condition.
The number of data bytes transferred between the start and the stop conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave
DATA OUTPUT BY TRANSMITTER not acknowledge DATA OUTPUT BY RECEIVER acknowledge SCL FROM MASTER S START CONDITION
MBC602
1
2
8
9
clock pulse for acknowledgement
Fig.7 Acknowledgment on the I2C-bus.
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
7 FUNCTIONAL DESCRIPTION
PCF8574
handbook, full pagewidth
write pulse 100 A data from shift register D FF CI S power-on reset D FF read pulse data to shift register CI S Q Q
VDD
P0 to P7
V SS
to interrupt logic
MBD977
Fig.8 Simplified schematic diagram of each I/O.
7.1
Addressing
For addressing see Figs 9, 10 and 11.
handbook, full pagewidth
slave address
slave address
S
0
1
0
0
A2
A1
A0
0
A
S
0
1
1
1
A2
A1
A0
0
A
MBD973
a.
(a) PCF8574. (b) PCF8574A.
b.
Fig.9 PCF8574 and PCF8574A slave addresses.
Each of the PCF8574's eight I/Os can be independently used as an input or output. Input data is transferred from the port to the microcontroller by the READ mode (see Fig.11). Output data is transmitted to the port by the WRITE mode (see Fig.10).
1997 Apr 02
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ndbook, full pagewidth
1997 Apr 02
5 6 7 8 data to port data to port A2 A1 A0 0 A DATA 1 A DATA 2 A
Philips Semiconductors
SCL
1
2
3
4
slave address (PCF8574)
SDA
S
0
1
0
0
Remote 8-bit I/O expander for I2C-bus
start condition
R/W
9
t pv
acknowledge from slave
acknowledge from slave
acknowledge from slave
WRITE TO PORT
DATA OUT FROM PORT
DATA 1 VALID t pv
DATA 2 VALID
MBD974
PCF8574
Product specification
Fig.10 WRITE mode (output).
1997 Apr 02
data from port data from port 0 DATA 4 A2 A1 A0 1 A DATA 1 A 1 P R/W acknowledge from slave acknowledge from slave stop condition
Philips Semiconductors
slave address (PCF8574)
SDA
S
0
1
0
start condition
Remote 8-bit I/O expander for I2C-bus
READ FROM PORT
10
DATA 2 t ph t ps DATA 3 DATA 4 t ir t ir
MBD975
DATA INTO PORT
INT
t iv
A LOW-to-HIGH transition of SDA, while SCL is HIGH is defined as the stop condition (P). Transfer of data can be stopped at any moment by a stop condition. When this occurs, data present at the last acknowledge phase is valid (output mode). Input data is lost.
PCF8574
Product specification
htdiwegap lluf ,koobdnah
Fig.11 READ mode (input).
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
7.2 Interrupt (see Figs 12 and 13)
PCF8574
* Interrupts which occur during the acknowledge clock pulse may be lost (or very short) due to the resetting of the interrupt during this pulse. Each change of the I/Os after resetting will be detected and, after the next rising clock edge, will be transmitted as INT. Reading from or writing to another device does not affect the interrupt circuit. 7.3 Quasi-bidirectional I/Os (see Fig.14)
The PCF8574 provides an open drain output (INT) which can be fed to a corresponding input of the microcontroller. This gives these chips a type of master function which can initiate an action elsewhere in the system. An interrupt is generated by any rising or falling edge of the port inputs in the input mode. After time tiv the signal INT is valid. Resetting and reactivating the interrupt circuit is achieved when data on the port is changed to the original setting or data is read from or written to the port which has generated the interrupt. Resetting occurs as follows: * In the READ mode at the acknowledge bit after the rising edge of the SCL signal * In the WRITE mode at the acknowledge bit after the HIGH-to-LOW transition of the SCL signal
A quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction. At power-on the I/Os are HIGH. In this mode only a current source to VDD is active. An additional strong pull-up to VDD allows fast rising edges into heavily loaded outputs. These devices turn on when an output is written HIGH, and are switched off by the negative edge of SCL. The I/Os should be HIGH before being used as inputs.
handbook, full pagewidth
V DD
PCF8574 (1)
PCF8574 (2)
PCF8574 (16)
MICROCOMPUTER INT
INT
INT
INT
MBD976
Fig.12 Application of multiple PCF8574s with interrupt.
handbook, full pagewidth
slave address (PCF8574)
data from port
SDA
S
0
1
0
0
A2
A1
A0
1
A
1
1
P
start condition
R/W
acknowledge P5 from slave
stop condition
SCL
1
2
3
4
5
6
7
8
DATA INTO P5
INT t iv t ir
MBD972
Fig.13 Interrupt generated by a change of input to I/O P5.
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handbook, full pagewidth
1997 Apr 02
data to port data to port 1 A2 A1 A0 0 A 1 A 0 A P R/W acknowledge from slave P3 P3
Philips Semiconductors
slave address (PCF8574A)
SDA
S
0
1
1
start condition
Remote 8-bit I/O expander for I2C-bus
SCL 4 5 6 7 8
1
2
3
12
I OHt
P3 OUTPUT VOLTAGE
P3 PULL-UP OUTPUT CURRENT
MBD971
I OH
PCF8574
Product specification
Fig.14 Transient pull-up current IOHt while P3 changes from LOW-to-HIGH and back to LOW.
Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VI II IO IDD ISS Ptot PO Tstg Tamb 9 supply voltage input voltage DC input current DC output current supply current supply current total power dissipation power dissipation per output storage temperature operating ambient temperature PARAMETER -0.5 VSS - 0.5 - - - - - - -65 -40 MIN. MAX. +7.0 VDD + 0.5 20 25 100 100 400 100 +150 +85
PCF8574
UNIT V V mA mA mA mA mW mW C C
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under "Handling MOS Devices". 10 DC CHARACTERISTICS VDD = 2.5 to 6 V; VSS = 0 V; Tamb = -40 to +85 C; unless otherwise specified. SYMBOL Supply VDD IDD supply voltage supply current 2.5 operating mode; VDD = 6 V; - no load; VI = VDD or VSS; fSCL = 100 kHz standby mode; VDD = 6 V; no load; VI = VDD or VSS VDD = 6 V; no load; VI = VDD or VSS; note 1 - - - 40 6.0 100 V A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Istb VPOR
standby current Power-on reset voltage
2.5 1.3
10 2.4
A V
Input SCL; input/output SDA VIL VIH IOL IL Ci LOW level input voltage HIGH level input voltage LOW level output current leakage current input capacitance VOL = 0.4 V VI = VDD or VSS VI = VSS -0.5 0.7VDD 3 -1 - - - - - - +0.3VDD VDD + 0.5 - +1 7 V V mA A pF
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
SYMBOL I/Os VIL VIH IIHL(max)
PARAMETER
CONDITIONS
MIN. -0.5 0.7VDD - - -
TYP.
MAX.
UNIT
LOW level input voltage HIGH level input voltage maximum allowed input current through protection diode LOW level output current HIGH level output current transient pull-up current VI VDD or VI VSS
+0.3VDD VDD + 0.5 400
V V A
-
IOL IOH IOHt
VOL = 1 V; VDD = 5 V VOH = VSS HIGH during acknowledge (see Fig.14); VOH = VSS; VDD = 2.5 V
10 30 -
25 - -1
- 300 -
mA A mA
Ci Co
input capacitance output capacitance
- - - 0 4
- - - - - - - - - - - -
10 10
pF pF s s s
Port timing; CL 100 pF (see Figs 10 and 11) tpv tsu th IOL IL tiv tir VIL VIH ILI Note 1. The Power-on reset circuit resets the I2C-bus logic with VDD < VPOR and sets all I/Os to logic 1 (with current source to VDD). output data valid input data set-up time input data hold time 4 - - - +1
Interrupt INT (see Fig.13) LOW level output current leakage current VOL = 0.4 V VI = VDD or VSS 1.6 -1 - - -0.5 0.7VDD pin at VDD or VSS -250 mA A s s
TIMING; CL 100 PF input data valid time reset delay time 4 4
Select inputs A0 to A2 LOW level input voltage HIGH level input voltage input leakage current +0.3VDD VDD + 0.5 +250 V V nA
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
11 I2C-BUS TIMING CHARACTERISTICS SYMBOL PARAMETER - - 4.7 4.7 4.0 4.7 4.0 - - 250 0 - 4.0 MIN. - - - - - - - - - - - - - TYP.
PCF8574
MAX.
UNIT
I2C-BUS TIMING (see Fig.15; note 1) fSCL tSW tBUF tSU;STA tHD;STA tLOW tHIGH tr tf tSU;DAT tHD;DAT tVD;DAT tSU;STO Note 1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to VIL and VIH with an input voltage swing of VSS to VDD. SCL clock frequency tolerable spike width on bus bus free time START condition set-up time START condition hold time SCL LOW time SCL HIGH time SCL and SDA rise time SCL and SDA fall time data set-up time data hold time SCL LOW to data out valid STOP condition set-up time 100 100 - - - - - 1.0 0.3 - - 3.4 - kHz ns s s s s s s s ns ns s s
handbook, full pagewidth
PROTOCOL
START CONDITION (S)
BIT 7 MSB (A7)
BIT 6 (A6)
BIT 0 LSB (R/W)
ACKNOWLEDGE (A)
STOP CONDITION (P)
t SU;STA
t LOW
t HIGH
1 / f SCL
SCL
t
BUF
tr
tf
SDA
t HD;STA
t SU;DAT
t
HD;DAT
t VD;DAT
MBD820
t SU;STO
Fig.15 I2C-bus timing diagram.
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
12 PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body
PCF8574
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
ISSUE DATE 92-10-02 95-01-19
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
PCF8574
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A X
c y HE vM A
Z
20
11
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
10
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 90-04-05 95-02-25
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
13 SOLDERING 13.1 Introduction
PCF8574
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 13.3.2 WAVE SOLDERING
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). 13.2 13.2.1 DIP SOLDERING BY DIPPING OR BY WAVE
Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.3.3 REPAIRING SOLDERED JOINTS
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 13.2.2 REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 13.3 13.3.1 SO and SSOP REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
14 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCF8574
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 15 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 16 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
NOTES
PCF8574
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
NOTES
PCF8574
1997 Apr 02
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Philips Semiconductors
Product specification
Remote 8-bit I/O expander for I2C-bus
NOTES
PCF8574
1997 Apr 02
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2870, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
417067/1200/02/pp24
Date of release: 1997 Apr 02
Document order number:
9397 750 01758

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